類似現象をシリカガラス板の貫通穿孔に応用

H. Hidai, N. Saito, S. Matsusaka, A. Chiba and N. Morita:
“Deep drilling of silica glass by continuous-wave laser backside irradiation”,
Applied Physics A, 122, p.277 (2016).

~200W@1095 nm, 3mm厚板にアスペクト比30